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Industry Standard Fdsoi Compact Model Bsim-Img for ic Design (Woodhead Publishing Series in Electronic and Optical Materials) (en Inglés)
Chenming Hu; Sourabh Khandelwal; Yogesh Singh Chauhan (Autor)
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Woodhead Publishing
· Tapa Blanda
Industry Standard Fdsoi Compact Model Bsim-Img for ic Design (Woodhead Publishing Series in Electronic and Optical Materials) (en Inglés) - Chenming Hu; Sourabh Khandelwal; Yogesh Singh Chauhan
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Reseña del libro "Industry Standard Fdsoi Compact Model Bsim-Img for ic Design (Woodhead Publishing Series in Electronic and Optical Materials) (en Inglés)"
Industry Standard FDSOI Compact Model BSIM-IMG for IC Design helps readers develop an understanding of a FDSOI device and its simulation model. It covers the physics and operation of the FDSOI device, explaining not only how FDSOI enables further scaling, but also how it offers unique possibilities in circuits. Following chapters cover the industry standard compact model BSIM-IMG for FDSOI devices. The book addresses core surface-potential calculations and the plethora of real devices and potential effects. Written by the original developers of the industrial standard model, this book is an excellent reference for the new BSIM-IMG compact model for emerging FDSOI technology. The authors include chapters on step-by-step parameters extraction procedure for BSIM-IMG model and rigorous industry grade tests that the BSIM-IMG model has undergone. There is also a chapter on analog and RF circuit design in FDSOI technology using the BSIM-IMG model. Provides a detailed discussion of the BSIM-IMG model and the industry standard simulation model for FDSOI, all presented by the developers of the modelExplains the complex operation of the FDSOI device and its use of two independent control inputsAddresses the parameter extraction challenges for those using this model
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